Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging

Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging

10.1016/j.tsf.2011.10.211

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Bibliographic Details
Main Authors: Song, X., Yeap, K.B., Zhu, J., Belnoue, J., Sebastiani, M., Bemporad, E., Zeng, K., Korsunsky, A.M.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Digital image correlation
Focused Ion Beam
Residual stress
Strain relief function
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61229
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/61229

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