Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM

10.1109/FLEPS.2019.8792259

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Main Authors: Samanta, Subhranu, Zhang, Panpan, Han, Kaizhen, Gong, Xiao, Chakraborty, Sandipan, Li, Yida, Fong, Xuanyao
Other Authors: ELECTRICAL AND COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: IEEE 2023
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Online Access:https://scholarbank.nus.edu.sg/handle/10635/245806
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-2458062024-04-16T11:53:01Z Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM Samanta, Subhranu Zhang, Panpan Han, Kaizhen Gong, Xiao Chakraborty, Sandipan Li, Yida Fong, Xuanyao ELECTRICAL AND COMPUTER ENGINEERING Science & Technology Technology Engineering, Manufacturing Engineering, Electrical & Electronic Instruments & Instrumentation Materials Science, Multidisciplinary Engineering Materials Science Flexible RRAM SiOx Low CC 10.1109/FLEPS.2019.8792259 1st IEEE International Conference on Flexible and Printable Sensors and Systems (IEEE FLEPS) 2023-11-08T04:00:45Z 2023-11-08T04:00:45Z 2019 2023-11-05T09:28:41Z Conference Paper Samanta, Subhranu, Zhang, Panpan, Han, Kaizhen, Gong, Xiao, Chakraborty, Sandipan, Li, Yida, Fong, Xuanyao (2019). Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM. 1st IEEE International Conference on Flexible and Printable Sensors and Systems (IEEE FLEPS). ScholarBank@NUS Repository. https://doi.org/10.1109/FLEPS.2019.8792259 9781538693049 https://scholarbank.nus.edu.sg/handle/10635/245806 IEEE Elements
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Science & Technology
Technology
Engineering, Manufacturing
Engineering, Electrical & Electronic
Instruments & Instrumentation
Materials Science, Multidisciplinary
Engineering
Materials Science
Flexible
RRAM
SiOx
Low CC
spellingShingle Science & Technology
Technology
Engineering, Manufacturing
Engineering, Electrical & Electronic
Instruments & Instrumentation
Materials Science, Multidisciplinary
Engineering
Materials Science
Flexible
RRAM
SiOx
Low CC
Samanta, Subhranu
Zhang, Panpan
Han, Kaizhen
Gong, Xiao
Chakraborty, Sandipan
Li, Yida
Fong, Xuanyao
Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM
description 10.1109/FLEPS.2019.8792259
author2 ELECTRICAL AND COMPUTER ENGINEERING
author_facet ELECTRICAL AND COMPUTER ENGINEERING
Samanta, Subhranu
Zhang, Panpan
Han, Kaizhen
Gong, Xiao
Chakraborty, Sandipan
Li, Yida
Fong, Xuanyao
format Conference or Workshop Item
author Samanta, Subhranu
Zhang, Panpan
Han, Kaizhen
Gong, Xiao
Chakraborty, Sandipan
Li, Yida
Fong, Xuanyao
author_sort Samanta, Subhranu
title Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM
title_short Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM
title_full Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM
title_fullStr Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM
title_full_unstemmed Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM
title_sort impact of ti interfacial layer on resistive switching characteristics at sub-μa current level in sio<sub>x</sub>-based flexible cross-point rram
publisher IEEE
publishDate 2023
url https://scholarbank.nus.edu.sg/handle/10635/245806
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