Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM
10.1109/FLEPS.2019.8792259
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2023
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sg-nus-scholar.10635-2458062024-04-16T11:53:01Z Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM Samanta, Subhranu Zhang, Panpan Han, Kaizhen Gong, Xiao Chakraborty, Sandipan Li, Yida Fong, Xuanyao ELECTRICAL AND COMPUTER ENGINEERING Science & Technology Technology Engineering, Manufacturing Engineering, Electrical & Electronic Instruments & Instrumentation Materials Science, Multidisciplinary Engineering Materials Science Flexible RRAM SiOx Low CC 10.1109/FLEPS.2019.8792259 1st IEEE International Conference on Flexible and Printable Sensors and Systems (IEEE FLEPS) 2023-11-08T04:00:45Z 2023-11-08T04:00:45Z 2019 2023-11-05T09:28:41Z Conference Paper Samanta, Subhranu, Zhang, Panpan, Han, Kaizhen, Gong, Xiao, Chakraborty, Sandipan, Li, Yida, Fong, Xuanyao (2019). Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM. 1st IEEE International Conference on Flexible and Printable Sensors and Systems (IEEE FLEPS). ScholarBank@NUS Repository. https://doi.org/10.1109/FLEPS.2019.8792259 9781538693049 https://scholarbank.nus.edu.sg/handle/10635/245806 IEEE Elements |
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Science & Technology Technology Engineering, Manufacturing Engineering, Electrical & Electronic Instruments & Instrumentation Materials Science, Multidisciplinary Engineering Materials Science Flexible RRAM SiOx Low CC |
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Science & Technology Technology Engineering, Manufacturing Engineering, Electrical & Electronic Instruments & Instrumentation Materials Science, Multidisciplinary Engineering Materials Science Flexible RRAM SiOx Low CC Samanta, Subhranu Zhang, Panpan Han, Kaizhen Gong, Xiao Chakraborty, Sandipan Li, Yida Fong, Xuanyao Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM |
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10.1109/FLEPS.2019.8792259 |
author2 |
ELECTRICAL AND COMPUTER ENGINEERING |
author_facet |
ELECTRICAL AND COMPUTER ENGINEERING Samanta, Subhranu Zhang, Panpan Han, Kaizhen Gong, Xiao Chakraborty, Sandipan Li, Yida Fong, Xuanyao |
format |
Conference or Workshop Item |
author |
Samanta, Subhranu Zhang, Panpan Han, Kaizhen Gong, Xiao Chakraborty, Sandipan Li, Yida Fong, Xuanyao |
author_sort |
Samanta, Subhranu |
title |
Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM |
title_short |
Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM |
title_full |
Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM |
title_fullStr |
Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM |
title_full_unstemmed |
Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM |
title_sort |
impact of ti interfacial layer on resistive switching characteristics at sub-μa current level in sio<sub>x</sub>-based flexible cross-point rram |
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IEEE |
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2023 |
url |
https://scholarbank.nus.edu.sg/handle/10635/245806 |
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1800915973663883264 |