Impact of Ti Interfacial Layer on Resistive Switching Characteristics at sub-μA Current Level in SiO<sub>x</sub>-Based Flexible Cross-Point RRAM
10.1109/FLEPS.2019.8792259
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| Main Authors: | , , , , , , |
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| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
IEEE
2023
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| Subjects: | |
| Online Access: | https://scholarbank.nus.edu.sg/handle/10635/245806 |
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| Institution: | National University of Singapore |