Method to reduce compressive stress in the silicon substrate during silicidation

US6284610

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Main Authors: CHA, RANDALL CHER LIANG, CHUA, CHEE TEE, PEY, KIN LEONG, CHAN, LAP
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Patent
Published: 2012
Online Access:http://scholarbank.nus.edu.sg/handle/10635/32598
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-325982015-07-29T07:03:43Z Method to reduce compressive stress in the silicon substrate during silicidation CHA, RANDALL CHER LIANG CHUA, CHEE TEE PEY, KIN LEONG CHAN, LAP ELECTRICAL & COMPUTER ENGINEERING CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (SINGAPORE, SG) NATIONAL UNIVERSITY OF SINGAPORE US6284610 Granted Patent 2012-05-02T02:27:35Z 2012-05-02T02:27:35Z 2001-09-04 Patent CHA, RANDALL CHER LIANG,CHUA, CHEE TEE,PEY, KIN LEONG,CHAN, LAP (2001-09-04). Method to reduce compressive stress in the silicon substrate during silicidation. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/32598 NOT_IN_WOS PatSnap
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description US6284610
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
CHA, RANDALL CHER LIANG
CHUA, CHEE TEE
PEY, KIN LEONG
CHAN, LAP
format Patent
author CHA, RANDALL CHER LIANG
CHUA, CHEE TEE
PEY, KIN LEONG
CHAN, LAP
spellingShingle CHA, RANDALL CHER LIANG
CHUA, CHEE TEE
PEY, KIN LEONG
CHAN, LAP
Method to reduce compressive stress in the silicon substrate during silicidation
author_sort CHA, RANDALL CHER LIANG
title Method to reduce compressive stress in the silicon substrate during silicidation
title_short Method to reduce compressive stress in the silicon substrate during silicidation
title_full Method to reduce compressive stress in the silicon substrate during silicidation
title_fullStr Method to reduce compressive stress in the silicon substrate during silicidation
title_full_unstemmed Method to reduce compressive stress in the silicon substrate during silicidation
title_sort method to reduce compressive stress in the silicon substrate during silicidation
publishDate 2012
url http://scholarbank.nus.edu.sg/handle/10635/32598
_version_ 1681081252645437440