Method to reduce compressive stress in the silicon substrate during silicidation
US6284610
Saved in:
Main Authors: | , , , |
---|---|
Other Authors: | |
Format: | Patent |
Published: |
2012
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/32598 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
id |
sg-nus-scholar.10635-32598 |
---|---|
record_format |
dspace |
spelling |
sg-nus-scholar.10635-325982015-07-29T07:03:43Z Method to reduce compressive stress in the silicon substrate during silicidation CHA, RANDALL CHER LIANG CHUA, CHEE TEE PEY, KIN LEONG CHAN, LAP ELECTRICAL & COMPUTER ENGINEERING CHARTERED SEMICONDUCTOR MANUFACTURING LTD. (SINGAPORE, SG) NATIONAL UNIVERSITY OF SINGAPORE US6284610 Granted Patent 2012-05-02T02:27:35Z 2012-05-02T02:27:35Z 2001-09-04 Patent CHA, RANDALL CHER LIANG,CHUA, CHEE TEE,PEY, KIN LEONG,CHAN, LAP (2001-09-04). Method to reduce compressive stress in the silicon substrate during silicidation. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/32598 NOT_IN_WOS PatSnap |
institution |
National University of Singapore |
building |
NUS Library |
country |
Singapore |
collection |
ScholarBank@NUS |
description |
US6284610 |
author2 |
ELECTRICAL & COMPUTER ENGINEERING |
author_facet |
ELECTRICAL & COMPUTER ENGINEERING CHA, RANDALL CHER LIANG CHUA, CHEE TEE PEY, KIN LEONG CHAN, LAP |
format |
Patent |
author |
CHA, RANDALL CHER LIANG CHUA, CHEE TEE PEY, KIN LEONG CHAN, LAP |
spellingShingle |
CHA, RANDALL CHER LIANG CHUA, CHEE TEE PEY, KIN LEONG CHAN, LAP Method to reduce compressive stress in the silicon substrate during silicidation |
author_sort |
CHA, RANDALL CHER LIANG |
title |
Method to reduce compressive stress in the silicon substrate during silicidation |
title_short |
Method to reduce compressive stress in the silicon substrate during silicidation |
title_full |
Method to reduce compressive stress in the silicon substrate during silicidation |
title_fullStr |
Method to reduce compressive stress in the silicon substrate during silicidation |
title_full_unstemmed |
Method to reduce compressive stress in the silicon substrate during silicidation |
title_sort |
method to reduce compressive stress in the silicon substrate during silicidation |
publishDate |
2012 |
url |
http://scholarbank.nus.edu.sg/handle/10635/32598 |
_version_ |
1681081252645437440 |