Method to reduce compressive stress in the silicon substrate during silicidation
US6284610
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Main Authors: | CHA, RANDALL CHER LIANG, CHUA, CHEE TEE, PEY, KIN LEONG, CHAN, LAP |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Patent |
Published: |
2012
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/32598 |
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Institution: | National University of Singapore |
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