Method to reduce compressive stress in the silicon substrate during silicidation

• Main Authors: CHA, RANDALL CHER LIANG, CHUA, CHEE TEE, PEY, KIN LEONG, CHAN, LAP
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Patent
• Published: 2012
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/32598
• Institution: National University of Singapore

US6284610