Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects

10.1016/j.mee.2004.05.003

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Bibliographic Details
Main Authors:	Balakumar, S., Wong, G., Tsang, C.F., Hara, T., Yoo, W.J.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Article
Published:	2014
Subjects:	Adhesion strength Cu interconnects Cu seed layer Stress and multi-stack
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/55891
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-55891
record_format	dspace
spelling	sg-nus-scholar.10635-558912023-10-25T23:30:00Z Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects Balakumar, S. Wong, G. Tsang, C.F. Hara, T. Yoo, W.J. ELECTRICAL & COMPUTER ENGINEERING Adhesion strength Cu interconnects Cu seed layer Stress and multi-stack 10.1016/j.mee.2004.05.003 Microelectronic Engineering 75 2 183-193 MIENE 2014-06-17T02:48:18Z 2014-06-17T02:48:18Z 2004-08 Article Balakumar, S., Wong, G., Tsang, C.F., Hara, T., Yoo, W.J. (2004-08). Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects. Microelectronic Engineering 75 (2) : 183-193. ScholarBank@NUS Repository. https://doi.org/10.1016/j.mee.2004.05.003 01679317 http://scholarbank.nus.edu.sg/handle/10635/55891 000223442000009 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Adhesion strength Cu interconnects Cu seed layer Stress and multi-stack
spellingShingle	Adhesion strength Cu interconnects Cu seed layer Stress and multi-stack Balakumar, S. Wong, G. Tsang, C.F. Hara, T. Yoo, W.J. Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects
description	10.1016/j.mee.2004.05.003
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Balakumar, S. Wong, G. Tsang, C.F. Hara, T. Yoo, W.J.
format	Article
author	Balakumar, S. Wong, G. Tsang, C.F. Hara, T. Yoo, W.J.
author_sort	Balakumar, S.
title	Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects
title_short	Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects
title_full	Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects
title_fullStr	Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects
title_full_unstemmed	Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects
title_sort	enhancement of adhesion strength of cu layer on single and multi-layer dielectric film stack in cu/low k multi-level interconnects
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/55891
_version_	1781781073338826752

Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects

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