Negative backside thermoreflectance modulation of microscale metal interconnects

10.1049/el.2011.0302

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Bibliographic Details
Main Authors:	Teo, J.K.J., Chua, C.M., Koh, L.S., Phang, J.C.H.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/56775
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Institution:	National University of Singapore

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