Negative backside thermoreflectance modulation of microscale metal interconnects

Negative backside thermoreflectance modulation of microscale metal interconnects

10.1049/el.2011.0302

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書目詳細資料
Main Authors:	Teo, J.K.J., Chua, C.M., Koh, L.S., Phang, J.C.H.
其他作者:	ELECTRICAL & COMPUTER ENGINEERING
格式:	Article
出版:	2014
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/56775
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	National University of Singapore

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