Study of leakage mechanisms of the copper/Black Diamond™ damascene process
10.1016/j.tsf.2004.05.051
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sg-nus-scholar.10635-575382023-10-30T21:52:25Z Study of leakage mechanisms of the copper/Black Diamond™ damascene process Yiang, K.Y. Guo, Q. Yoo, W.J. Krishnamoorthy, A. ELECTRICAL & COMPUTER ENGINEERING Conduction mechanisms Interconnects Low-k 10.1016/j.tsf.2004.05.051 Thin Solid Films 462-463 SPEC. ISS. 330-333 THSFA 2014-06-17T03:07:19Z 2014-06-17T03:07:19Z 2004-09 Article Yiang, K.Y., Guo, Q., Yoo, W.J., Krishnamoorthy, A. (2004-09). Study of leakage mechanisms of the copper/Black Diamond™ damascene process. Thin Solid Films 462-463 (SPEC. ISS.) : 330-333. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2004.05.051 00406090 http://scholarbank.nus.edu.sg/handle/10635/57538 000223812800068 Scopus |
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Conduction mechanisms Interconnects Low-k |
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Conduction mechanisms Interconnects Low-k Yiang, K.Y. Guo, Q. Yoo, W.J. Krishnamoorthy, A. Study of leakage mechanisms of the copper/Black Diamond™ damascene process |
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10.1016/j.tsf.2004.05.051 |
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ELECTRICAL & COMPUTER ENGINEERING |
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ELECTRICAL & COMPUTER ENGINEERING Yiang, K.Y. Guo, Q. Yoo, W.J. Krishnamoorthy, A. |
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Article |
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Yiang, K.Y. Guo, Q. Yoo, W.J. Krishnamoorthy, A. |
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Yiang, K.Y. |
title |
Study of leakage mechanisms of the copper/Black Diamond™ damascene process |
title_short |
Study of leakage mechanisms of the copper/Black Diamond™ damascene process |
title_full |
Study of leakage mechanisms of the copper/Black Diamond™ damascene process |
title_fullStr |
Study of leakage mechanisms of the copper/Black Diamond™ damascene process |
title_full_unstemmed |
Study of leakage mechanisms of the copper/Black Diamond™ damascene process |
title_sort |
study of leakage mechanisms of the copper/black diamond™ damascene process |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/57538 |
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1781781430921068544 |