The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization

The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization

10.1063/1.3074367

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Main Authors: Yu, D.-Q., Lee, C., Yan, L.L., Choi, W.K., Yu, A., Lau, J.H.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/57637
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Institution: National University of Singapore
id sg-nus-scholar.10635-57637
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spelling sg-nus-scholar.10635-576372024-11-09T08:00:05Z The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization Yu, D.-Q. Lee, C. Yan, L.L. Choi, W.K. Yu, A. Lau, J.H. ELECTRICAL & COMPUTER ENGINEERING 10.1063/1.3074367 Applied Physics Letters 94 3 - APPLA 2014-06-17T03:08:28Z 2014-06-17T03:08:28Z 2009 Article Yu, D.-Q., Lee, C., Yan, L.L., Choi, W.K., Yu, A., Lau, J.H. (2009). The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization. Applied Physics Letters 94 (3) : -. ScholarBank@NUS Repository. https://doi.org/10.1063/1.3074367 00036951 http://scholarbank.nus.edu.sg/handle/10635/57637 000262724000049 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1063/1.3074367
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
Yu, D.-Q.
Lee, C.
Yan, L.L.
Choi, W.K.
Yu, A.
Lau, J.H.
format Article
author Yu, D.-Q.
Lee, C.
Yan, L.L.
Choi, W.K.
Yu, A.
Lau, J.H.
spellingShingle Yu, D.-Q.
Lee, C.
Yan, L.L.
Choi, W.K.
Yu, A.
Lau, J.H.
The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization
author_sort Yu, D.-Q.
title The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization
title_short The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization
title_full The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization
title_fullStr The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization
title_full_unstemmed The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization
title_sort role of ni buffer layer on high yield low temperature hermetic wafer bonding using in/sn/cu metallization
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/57637
_version_ 1821188695211900928

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