A silicon platform with MEMS active alignment function and its potential application in Si-photonics packaging

• Main Authors: Zhang, Q.X., Du, Y., Tan, C.W., Zhang, J., Yu, M.B., Yeoh, W.G., Lo, G.-Q., Kwong, D.-L.
• Other Authors: MECHANICAL ENGINEERING
• Format: Article
• Published: 2014
• Subjects: Active alignment; Assembly; Electrothermal actuation; Mechanical locking; Microactuators; Si photonics
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/59262
• Institution: National University of Singapore

10.1109/JSTQE.2009.2034271