Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging
10.1109/TADVP.2008.924247
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2014
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sg-nus-scholar.10635-611142023-10-27T07:44:29Z Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. Kumar, R. Lo, G.Q. MECHANICAL ENGINEERING Benzocyclobutene (BCB) Compliance Electrical parasitic Planar microspring interconnect S-parameter 10.1109/TADVP.2008.924247 IEEE Transactions on Advanced Packaging 32 2 379-389 ITAPF 2014-06-17T06:31:11Z 2014-06-17T06:31:11Z 2009 Article Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Lo, G.Q. (2009). Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging. IEEE Transactions on Advanced Packaging 32 (2) : 379-389. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2008.924247 15213323 http://scholarbank.nus.edu.sg/handle/10635/61114 000266778000015 Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| topic |
Benzocyclobutene (BCB) Compliance Electrical parasitic Planar microspring interconnect S-parameter |
| spellingShingle |
Benzocyclobutene (BCB) Compliance Electrical parasitic Planar microspring interconnect S-parameter Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. Kumar, R. Lo, G.Q. Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging |
| description |
10.1109/TADVP.2008.924247 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. Kumar, R. Lo, G.Q. |
| format |
Article |
| author |
Liao, E.B. Tay, A.A.O. Ang, S.S.T. Feng, H.H. Nagarajan, R. Kripesh, V. Kumar, R. Lo, G.Q. |
| author_sort |
Liao, E.B. |
| title |
Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging |
| title_short |
Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging |
| title_full |
Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging |
| title_fullStr |
Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging |
| title_full_unstemmed |
Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging |
| title_sort |
planar microspring - a novel compliant chip-to-package interconnect for wafer-level packaging |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/61114 |
| _version_ |
1781781981264084992 |