Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging

Planar microspring - A novel compliant chip-to-package interconnect for wafer-level packaging

10.1109/TADVP.2008.924247

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Bibliographic Details
Main Authors: Liao, E.B., Tay, A.A.O., Ang, S.S.T., Feng, H.H., Nagarajan, R., Kripesh, V., Kumar, R., Lo, G.Q.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Benzocyclobutene (BCB)
Compliance
Electrical parasitic
Planar microspring interconnect
S-parameter
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61114
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Institution: National University of Singapore

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