Via design optimization for high speed device packaging
Proceedings of the Electronic Packaging Technology Conference, EPTC
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Main Authors: | Low, Hong-Guan, Iyer, Mahadevan K., Ooi, Ban-Leong, Leong, Mook-Seng |
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Other Authors: | INSTITUTE OF MICROELECTRONICS |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/62927 |
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Institution: | National University of Singapore |
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