Characterization of MOS Devices by Scanning Thermal Microscopy (SThM)

Conference Proceedings from the International Symposium for Testing and Failure Analysis

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Bibliographic Details
Main Authors: Lee, T.H., Fiege, G.B.M., Altes, A., Zimmermann, G., Ng, V., Heiderhoff, R., Phang, J.C.H., Balk, L.J.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/69588
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Institution: National University of Singapore
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