Characterization of MOS Devices by Scanning Thermal Microscopy (SThM)
Conference Proceedings from the International Symposium for Testing and Failure Analysis
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Main Authors: | Lee, T.H., Fiege, G.B.M., Altes, A., Zimmermann, G., Ng, V., Heiderhoff, R., Phang, J.C.H., Balk, L.J. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/69588 |
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Institution: | National University of Singapore |
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