Circuit model of elastomer probe for fine pitch wafer level package test applications

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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Bibliographic Details
Main Authors:	Jayabalan, J., Ooi, B.L., Leong, M.S., Iyer, M.K.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/69603
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-69603
record_format	dspace
spelling	sg-nus-scholar.10635-696032024-11-10T17:39:18Z Circuit model of elastomer probe for fine pitch wafer level package test applications Jayabalan, J. Ooi, B.L. Leong, M.S. Iyer, M.K. ELECTRICAL & COMPUTER ENGINEERING MECHANICAL ENGINEERING Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 1 175-178 2014-06-19T03:02:32Z 2014-06-19T03:02:32Z 2005 Conference Paper Jayabalan, J.,Ooi, B.L.,Leong, M.S.,Iyer, M.K. (2005). Circuit model of elastomer probe for fine pitch wafer level package test applications. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 1 : 175-178. ScholarBank@NUS Repository. 0780395786 http://scholarbank.nus.edu.sg/handle/10635/69603 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Jayabalan, J. Ooi, B.L. Leong, M.S. Iyer, M.K.
format	Conference or Workshop Item
author	Jayabalan, J. Ooi, B.L. Leong, M.S. Iyer, M.K.
spellingShingle	Jayabalan, J. Ooi, B.L. Leong, M.S. Iyer, M.K. Circuit model of elastomer probe for fine pitch wafer level package test applications
author_sort	Jayabalan, J.
title	Circuit model of elastomer probe for fine pitch wafer level package test applications
title_short	Circuit model of elastomer probe for fine pitch wafer level package test applications
title_full	Circuit model of elastomer probe for fine pitch wafer level package test applications
title_fullStr	Circuit model of elastomer probe for fine pitch wafer level package test applications
title_full_unstemmed	Circuit model of elastomer probe for fine pitch wafer level package test applications
title_sort	circuit model of elastomer probe for fine pitch wafer level package test applications
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/69603
_version_	1821193450451632128

Circuit model of elastomer probe for fine pitch wafer level package test applications

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