Circuit model of elastomer probe for fine pitch wafer level package test applications

Circuit model of elastomer probe for fine pitch wafer level package test applications

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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Bibliographic Details
Main Authors: Jayabalan, J., Ooi, B.L., Leong, M.S., Iyer, M.K.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/69603
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/69603

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