Circuit model of elastomer probe for fine pitch wafer level package test applications

• Main Authors: Jayabalan, J., Ooi, B.L., Leong, M.S., Iyer, M.K.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/69603
• Institution: National University of Singapore

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005