Metallization and dielectric reliability in Cu interconnects: Effect of cap layers and surface treatments

Advanced Metallization Conference (AMC)

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Bibliographic Details
Main Authors:	Krishnamoorthy, A., Vairagar, A.V., Yiang, K.Y., Mhaisalkar, S.G., Yoo, W.J.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Subjects:	Conduction mechanism Dielectric breakdown Electromigration Interconnects Leakage current Low-k
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/70918
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-70918
record_format	dspace
spelling	sg-nus-scholar.10635-709182015-01-06T09:55:27Z Metallization and dielectric reliability in Cu interconnects: Effect of cap layers and surface treatments Krishnamoorthy, A. Vairagar, A.V. Yiang, K.Y. Mhaisalkar, S.G. Yoo, W.J. ELECTRICAL & COMPUTER ENGINEERING Conduction mechanism Dielectric breakdown Electromigration Interconnects Leakage current Low-k Advanced Metallization Conference (AMC) 179-188 MRSPD 2014-06-19T03:17:46Z 2014-06-19T03:17:46Z 2004 Conference Paper Krishnamoorthy, A.,Vairagar, A.V.,Yiang, K.Y.,Mhaisalkar, S.G.,Yoo, W.J. (2004). Metallization and dielectric reliability in Cu interconnects: Effect of cap layers and surface treatments. Advanced Metallization Conference (AMC) : 179-188. ScholarBank@NUS Repository. 15401766 http://scholarbank.nus.edu.sg/handle/10635/70918 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
topic	Conduction mechanism Dielectric breakdown Electromigration Interconnects Leakage current Low-k
spellingShingle	Conduction mechanism Dielectric breakdown Electromigration Interconnects Leakage current Low-k Krishnamoorthy, A. Vairagar, A.V. Yiang, K.Y. Mhaisalkar, S.G. Yoo, W.J. Metallization and dielectric reliability in Cu interconnects: Effect of cap layers and surface treatments
description	Advanced Metallization Conference (AMC)
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Krishnamoorthy, A. Vairagar, A.V. Yiang, K.Y. Mhaisalkar, S.G. Yoo, W.J.
format	Conference or Workshop Item
author	Krishnamoorthy, A. Vairagar, A.V. Yiang, K.Y. Mhaisalkar, S.G. Yoo, W.J.
author_sort	Krishnamoorthy, A.
title	Metallization and dielectric reliability in Cu interconnects: Effect of cap layers and surface treatments
title_short	Metallization and dielectric reliability in Cu interconnects: Effect of cap layers and surface treatments
title_full	Metallization and dielectric reliability in Cu interconnects: Effect of cap layers and surface treatments
title_fullStr	Metallization and dielectric reliability in Cu interconnects: Effect of cap layers and surface treatments
title_full_unstemmed	Metallization and dielectric reliability in Cu interconnects: Effect of cap layers and surface treatments
title_sort	metallization and dielectric reliability in cu interconnects: effect of cap layers and surface treatments
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/70918
_version_	1681087288312856576

Metallization and dielectric reliability in Cu interconnects: Effect of cap layers and surface treatments

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