Nondestructive defect characterization of saw-damage-etched multicrystalline silicon wafers using scanning electron acoustic microscopy

• Main Authors: Meng, L., Rao, S.S.P., Bhatia, C.S., Steen, S.E., Street, A.G., Phang, J.C.H.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Multicrystalline silicon; nondestructive defect characterization; saw-damage etch; scanning electron acoustic microscopy (SEAM)
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/71147
• Institution: National University of Singapore

Conference Record of the IEEE Photovoltaic Specialists Conference