The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding
10.1109/EMAP.2008.4784256
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2014
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sg-nus-scholar.10635-719962023-10-27T08:10:07Z The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding Yu, D. Lee, C. Lau, J.H. ELECTRICAL & COMPUTER ENGINEERING 10.1109/EMAP.2008.4784256 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 171-174 2014-06-19T03:30:14Z 2014-06-19T03:30:14Z 2008 Conference Paper Yu, D., Lee, C., Lau, J.H. (2008). The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding. 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 : 171-174. ScholarBank@NUS Repository. https://doi.org/10.1109/EMAP.2008.4784256 9781424436217 http://scholarbank.nus.edu.sg/handle/10635/71996 000264237400038 Scopus |
| institution |
National University of Singapore |
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NUS Library |
| continent |
Asia |
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Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
10.1109/EMAP.2008.4784256 |
| author2 |
ELECTRICAL & COMPUTER ENGINEERING |
| author_facet |
ELECTRICAL & COMPUTER ENGINEERING Yu, D. Lee, C. Lau, J.H. |
| format |
Conference or Workshop Item |
| author |
Yu, D. Lee, C. Lau, J.H. |
| spellingShingle |
Yu, D. Lee, C. Lau, J.H. The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding |
| author_sort |
Yu, D. |
| title |
The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding |
| title_short |
The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding |
| title_full |
The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding |
| title_fullStr |
The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding |
| title_full_unstemmed |
The role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding |
| title_sort |
role ofni buffer layer between insn solder and eu metallization for hermetic wafer bonding |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/71996 |
| _version_ |
1781783235018096640 |