Optimization of reliability of copper column flip chip packages with variable compliance interconnects

Optimization of reliability of copper column flip chip packages with variable compliance interconnects

10.1109/EPTC.2007.4469820

Saved in:
Bibliographic Details
Main Authors: Tay, A.A.O., Ho, S.L.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73728
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Description
Summary:10.1109/EPTC.2007.4469820

Similar Items