Optimization of reliability of copper column flip chip packages with variable compliance interconnects
10.1109/EPTC.2007.4469820
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2014
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sg-nus-scholar.10635-737282023-10-30T20:23:33Z Optimization of reliability of copper column flip chip packages with variable compliance interconnects Tay, A.A.O. Ho, S.L. MECHANICAL ENGINEERING 10.1109/EPTC.2007.4469820 Proceedings of the Electronic Packaging Technology Conference, EPTC 499-503 2014-06-19T05:38:39Z 2014-06-19T05:38:39Z 2007 Conference Paper Tay, A.A.O., Ho, S.L. (2007). Optimization of reliability of copper column flip chip packages with variable compliance interconnects. Proceedings of the Electronic Packaging Technology Conference, EPTC : 499-503. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469820 1424413249 http://scholarbank.nus.edu.sg/handle/10635/73728 000253874600090 Scopus |
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National University of Singapore |
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NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
10.1109/EPTC.2007.4469820 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Tay, A.A.O. Ho, S.L. |
| format |
Conference or Workshop Item |
| author |
Tay, A.A.O. Ho, S.L. |
| spellingShingle |
Tay, A.A.O. Ho, S.L. Optimization of reliability of copper column flip chip packages with variable compliance interconnects |
| author_sort |
Tay, A.A.O. |
| title |
Optimization of reliability of copper column flip chip packages with variable compliance interconnects |
| title_short |
Optimization of reliability of copper column flip chip packages with variable compliance interconnects |
| title_full |
Optimization of reliability of copper column flip chip packages with variable compliance interconnects |
| title_fullStr |
Optimization of reliability of copper column flip chip packages with variable compliance interconnects |
| title_full_unstemmed |
Optimization of reliability of copper column flip chip packages with variable compliance interconnects |
| title_sort |
optimization of reliability of copper column flip chip packages with variable compliance interconnects |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73728 |
| _version_ |
1781783330677587968 |