A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint
10.1109/ECTC.2008.4550232
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2014
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sg-nus-scholar.10635-833512015-01-06T14:26:04Z A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint Yan, L. Lee, C. Yu, D. Choi, W.K. Yu, A. Yoon, S.U. Lau, J.H. ELECTRICAL & COMPUTER ENGINEERING 10.1109/ECTC.2008.4550232 Proceedings - Electronic Components and Technology Conference 1844-1848 PECCA 2014-10-07T04:40:16Z 2014-10-07T04:40:16Z 2008 Conference Paper Yan, L.,Lee, C.,Yu, D.,Choi, W.K.,Yu, A.,Yoon, S.U.,Lau, J.H. (2008). A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint. Proceedings - Electronic Components and Technology Conference : 1844-1848. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ECTC.2008.4550232" target="_blank">https://doi.org/10.1109/ECTC.2008.4550232</a> 9781424422302 05695503 http://scholarbank.nus.edu.sg/handle/10635/83351 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
10.1109/ECTC.2008.4550232 |
| author2 |
ELECTRICAL & COMPUTER ENGINEERING |
| author_facet |
ELECTRICAL & COMPUTER ENGINEERING Yan, L. Lee, C. Yu, D. Choi, W.K. Yu, A. Yoon, S.U. Lau, J.H. |
| format |
Conference or Workshop Item |
| author |
Yan, L. Lee, C. Yu, D. Choi, W.K. Yu, A. Yoon, S.U. Lau, J.H. |
| spellingShingle |
Yan, L. Lee, C. Yu, D. Choi, W.K. Yu, A. Yoon, S.U. Lau, J.H. A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint |
| author_sort |
Yan, L. |
| title |
A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint |
| title_short |
A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint |
| title_full |
A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint |
| title_fullStr |
A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint |
| title_full_unstemmed |
A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint |
| title_sort |
hermetic chip to chip bonding at low temperature with cu/in/sn/cu joint |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/83351 |
| _version_ |
1681089419914772480 |