A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint

10.1109/ECTC.2008.4550232

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Bibliographic Details
Main Authors:	Yan, L., Lee, C., Yu, D., Choi, W.K., Yu, A., Yoon, S.U., Lau, J.H.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/83351
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Institution:	National University of Singapore

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