A hermetic chip to chip bonding at low temperature with Cu/In/Sn/Cu joint
10.1109/ECTC.2008.4550232
Saved in:
Main Authors: | , , , , , , |
---|---|
Other Authors: | |
Format: | Conference or Workshop Item |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/83351 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |