A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu

A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu

10.1007/s11664-008-0561-x

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Bibliographic Details
Main Authors: Yan, L.-L., Lee, C.-K., Yu, D.-Q., Yu, A.-B., Choi, W.-K., Lau, J.-H., Yoon, S.-U.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Copper
In/Sn solder
Interfacial reaction
Intermetallic compounds
Low-temperature bonding
Online Access:http://scholarbank.nus.edu.sg/handle/10635/83352
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Institution: National University of Singapore
Description
Summary:10.1007/s11664-008-0561-x

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