A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu
10.1007/s11664-008-0561-x
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2014
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sg-nus-scholar.10635-833522023-10-29T21:02:08Z A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu Yan, L.-L. Lee, C.-K. Yu, D.-Q. Yu, A.-B. Choi, W.-K. Lau, J.-H. Yoon, S.-U. ELECTRICAL & COMPUTER ENGINEERING Copper In/Sn solder Interfacial reaction Intermetallic compounds Low-temperature bonding 10.1007/s11664-008-0561-x Journal of Electronic Materials 38 1 200-207 JECMA 2014-10-07T04:40:16Z 2014-10-07T04:40:16Z 2009-01 Conference Paper Yan, L.-L., Lee, C.-K., Yu, D.-Q., Yu, A.-B., Choi, W.-K., Lau, J.-H., Yoon, S.-U. (2009-01). A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu. Journal of Electronic Materials 38 (1) : 200-207. ScholarBank@NUS Repository. https://doi.org/10.1007/s11664-008-0561-x 03615235 http://scholarbank.nus.edu.sg/handle/10635/83352 000261789900025 Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| topic |
Copper In/Sn solder Interfacial reaction Intermetallic compounds Low-temperature bonding |
| spellingShingle |
Copper In/Sn solder Interfacial reaction Intermetallic compounds Low-temperature bonding Yan, L.-L. Lee, C.-K. Yu, D.-Q. Yu, A.-B. Choi, W.-K. Lau, J.-H. Yoon, S.-U. A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu |
| description |
10.1007/s11664-008-0561-x |
| author2 |
ELECTRICAL & COMPUTER ENGINEERING |
| author_facet |
ELECTRICAL & COMPUTER ENGINEERING Yan, L.-L. Lee, C.-K. Yu, D.-Q. Yu, A.-B. Choi, W.-K. Lau, J.-H. Yoon, S.-U. |
| format |
Conference or Workshop Item |
| author |
Yan, L.-L. Lee, C.-K. Yu, D.-Q. Yu, A.-B. Choi, W.-K. Lau, J.-H. Yoon, S.-U. |
| author_sort |
Yan, L.-L. |
| title |
A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu |
| title_short |
A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu |
| title_full |
A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu |
| title_fullStr |
A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu |
| title_full_unstemmed |
A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu |
| title_sort |
hermetic seal using composite thin-film in/sn solder as an intermediate layer and its interdiffusion reaction with cu |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/83352 |
| _version_ |
1781784354674966528 |