A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu

10.1007/s11664-008-0561-x

Saved in:

Bibliographic Details
Main Authors:	Yan, L.-L., Lee, C.-K., Yu, D.-Q., Yu, A.-B., Choi, W.-K., Lau, J.-H., Yoon, S.-U.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Subjects:	Copper In/Sn solder Interfacial reaction Intermetallic compounds Low-temperature bonding
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/83352
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

Be the first to leave a comment!

Similar Items