Experimental characterization of the reliability of multi-terminal dual-damascene copper interconnect trees

Experimental characterization of the reliability of multi-terminal dual-damascene copper interconnect trees

Materials Research Society Symposium - Proceedings

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Bibliographic Details
Main Authors: Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K., Chang, C.W., Guo, Q.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/83713
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Institution: National University of Singapore
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Summary:Materials Research Society Symposium - Proceedings

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