Experimental characterization of the reliability of multi-terminal dual-damascene copper interconnect trees

• Main Authors: Gan, C.L., Thompson, C.V., Pey, K.L., Choi, W.K., Chang, C.W., Guo, Q.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/83713
• Institution: National University of Singapore

Materials Research Society Symposium - Proceedings