Reliability improvement to copper damascene structures using buried capping layer

Advanced Metallization Conference (AMC)

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Bibliographic Details
Main Authors:	Yiang, K.Y., Yoo, W.J., Krishnamoorthy, A.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/84134
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-84134
record_format	dspace
spelling	sg-nus-scholar.10635-841342015-01-08T19:11:16Z Reliability improvement to copper damascene structures using buried capping layer Yiang, K.Y. Yoo, W.J. Krishnamoorthy, A. ELECTRICAL & COMPUTER ENGINEERING Advanced Metallization Conference (AMC) 271-275 MRSPD 2014-10-07T04:49:12Z 2014-10-07T04:49:12Z 2003 Conference Paper Yiang, K.Y.,Yoo, W.J.,Krishnamoorthy, A. (2003). Reliability improvement to copper damascene structures using buried capping layer. Advanced Metallization Conference (AMC) : 271-275. ScholarBank@NUS Repository. 15401766 http://scholarbank.nus.edu.sg/handle/10635/84134 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Advanced Metallization Conference (AMC)
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Yiang, K.Y. Yoo, W.J. Krishnamoorthy, A.
format	Conference or Workshop Item
author	Yiang, K.Y. Yoo, W.J. Krishnamoorthy, A.
spellingShingle	Yiang, K.Y. Yoo, W.J. Krishnamoorthy, A. Reliability improvement to copper damascene structures using buried capping layer
author_sort	Yiang, K.Y.
title	Reliability improvement to copper damascene structures using buried capping layer
title_short	Reliability improvement to copper damascene structures using buried capping layer
title_full	Reliability improvement to copper damascene structures using buried capping layer
title_fullStr	Reliability improvement to copper damascene structures using buried capping layer
title_full_unstemmed	Reliability improvement to copper damascene structures using buried capping layer
title_sort	reliability improvement to copper damascene structures using buried capping layer
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/84134
_version_	1681089563084193792

Reliability improvement to copper damascene structures using buried capping layer

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