Reliability improvement to copper damascene structures using buried capping layer

Advanced Metallization Conference (AMC)

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Bibliographic Details
Main Authors: Yiang, K.Y., Yoo, W.J., Krishnamoorthy, A.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/84134
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Institution: National University of Singapore
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