Solutions strategies for die shift problem in wafer level compression molding

10.1109/TCPMT.2010.2100431

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Bibliographic Details
Main Authors:	Sharma, G., Kumar, A., Rao, V.S., Ho, S.W., Kripesh, V.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Die shift embedded wafer level package wafer molding
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/85652
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-85652
record_format	dspace
spelling	sg-nus-scholar.10635-856522023-10-26T20:08:53Z Solutions strategies for die shift problem in wafer level compression molding Sharma, G. Kumar, A. Rao, V.S. Ho, S.W. Kripesh, V. MECHANICAL ENGINEERING Die shift embedded wafer level package wafer molding 10.1109/TCPMT.2010.2100431 IEEE Transactions on Components, Packaging and Manufacturing Technology 1 4 502-509 2014-10-07T09:10:33Z 2014-10-07T09:10:33Z 2011 Article Sharma, G., Kumar, A., Rao, V.S., Ho, S.W., Kripesh, V. (2011). Solutions strategies for die shift problem in wafer level compression molding. IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (4) : 502-509. ScholarBank@NUS Repository. https://doi.org/10.1109/TCPMT.2010.2100431 21563950 http://scholarbank.nus.edu.sg/handle/10635/85652 000292827500005 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Die shift embedded wafer level package wafer molding
spellingShingle	Die shift embedded wafer level package wafer molding Sharma, G. Kumar, A. Rao, V.S. Ho, S.W. Kripesh, V. Solutions strategies for die shift problem in wafer level compression molding
description	10.1109/TCPMT.2010.2100431
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Sharma, G. Kumar, A. Rao, V.S. Ho, S.W. Kripesh, V.
format	Article
author	Sharma, G. Kumar, A. Rao, V.S. Ho, S.W. Kripesh, V.
author_sort	Sharma, G.
title	Solutions strategies for die shift problem in wafer level compression molding
title_short	Solutions strategies for die shift problem in wafer level compression molding
title_full	Solutions strategies for die shift problem in wafer level compression molding
title_fullStr	Solutions strategies for die shift problem in wafer level compression molding
title_full_unstemmed	Solutions strategies for die shift problem in wafer level compression molding
title_sort	solutions strategies for die shift problem in wafer level compression molding
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/85652
_version_	1781784726145597440

Solutions strategies for die shift problem in wafer level compression molding

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