Solutions strategies for die shift problem in wafer level compression molding
10.1109/TCPMT.2010.2100431
Saved in:
Main Authors: | Sharma, G., Kumar, A., Rao, V.S., Ho, S.W., Kripesh, V. |
---|---|
Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
|
Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/85652 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Wafer level packaging of pressure sensor using SU8 photoresist
by: Iliescu, C., et al.
Published: (2014) -
Characterization of intermediate In/Ag layers of low temperature fluxless solder based wafer bonding for MEMS packaging
by: Lee, C., et al.
Published: (2014) -
Development of wafer level packaged scanning micromirrors
by: Yu, A., et al.
Published: (2014) -
Wafer-level hermetic bonding using Sn/In and Cu/Ti/Au metallization
by: Yu, D.-Q., et al.
Published: (2014) -
Evaluation of fan-out wafer level package strength
by: Xu, Cheng, et al.
Published: (2021)