Solutions strategies for die shift problem in wafer level compression molding

10.1109/TCPMT.2010.2100431

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Bibliographic Details
Main Authors: Sharma, G., Kumar, A., Rao, V.S., Ho, S.W., Kripesh, V.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
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Online Access:http://scholarbank.nus.edu.sg/handle/10635/85652
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Institution: National University of Singapore

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