Solutions strategies for die shift problem in wafer level compression molding

• Main Authors: Sharma, G., Kumar, A., Rao, V.S., Ho, S.W., Kripesh, V.
• Other Authors: MECHANICAL ENGINEERING
• Format: Article
• Published: 2014
• Subjects: Die shift; embedded wafer level package; wafer molding
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/85652
• Institution: National University of Singapore

10.1109/TCPMT.2010.2100431