3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages

3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages

10.1109/ECTC.2013.6575666

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Bibliographic Details
Main Authors: Ho, S.L., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85848
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Institution: National University of Singapore
Description
Summary:10.1109/ECTC.2013.6575666

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