3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages
10.1109/ECTC.2013.6575666
Saved in:
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
2014
|
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/85848 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | National University of Singapore |