3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages
10.1109/ECTC.2013.6575666
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2014
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sg-nus-scholar.10635-858482015-01-17T18:14:19Z 3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages Ho, S.L. Tay, A.A.O. MECHANICAL ENGINEERING 10.1109/ECTC.2013.6575666 Proceedings - Electronic Components and Technology Conference 807-812 PECCA 2014-10-07T09:12:55Z 2014-10-07T09:12:55Z 2013 Conference Paper Ho, S.L.,Tay, A.A.O. (2013). 3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages. Proceedings - Electronic Components and Technology Conference : 807-812. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ECTC.2013.6575666" target="_blank">https://doi.org/10.1109/ECTC.2013.6575666</a> 9781479902330 05695503 http://scholarbank.nus.edu.sg/handle/10635/85848 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
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ScholarBank@NUS |
| description |
10.1109/ECTC.2013.6575666 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Ho, S.L. Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Ho, S.L. Tay, A.A.O. |
| spellingShingle |
Ho, S.L. Tay, A.A.O. 3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages |
| author_sort |
Ho, S.L. |
| title |
3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages |
| title_short |
3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages |
| title_full |
3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages |
| title_fullStr |
3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages |
| title_full_unstemmed |
3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages |
| title_sort |
3d vs 2d modeling of the effect of die size on delamination in encapsulated ic packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/85848 |
| _version_ |
1681089875806257152 |