3D vs 2D modeling of the effect of die size on delamination in encapsulated IC packages
10.1109/ECTC.2013.6575666
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| Main Authors: | , |
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| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
2014
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/85848 |
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| Institution: | National University of Singapore |
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