Bed of nails: Fine pitch wafer-level packaging interconnects for high performance nano devices

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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Bibliographic Details
Main Authors:	Rao, V.S., Kripesh, V., Yoon, S.W., Witarsa, D., Tay, A.A.O.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/85887
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-85887
record_format	dspace
spelling	sg-nus-scholar.10635-858872024-11-13T13:23:22Z Bed of nails: Fine pitch wafer-level packaging interconnects for high performance nano devices Rao, V.S. Kripesh, V. Yoon, S.W. Witarsa, D. Tay, A.A.O. MECHANICAL ENGINEERING Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 2 658-663 2014-10-07T09:13:22Z 2014-10-07T09:13:22Z 2005 Conference Paper Rao, V.S.,Kripesh, V.,Yoon, S.W.,Witarsa, D.,Tay, A.A.O. (2005). Bed of nails: Fine pitch wafer-level packaging interconnects for high performance nano devices. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 2 : 658-663. ScholarBank@NUS Repository. 0780395786 http://scholarbank.nus.edu.sg/handle/10635/85887 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Rao, V.S. Kripesh, V. Yoon, S.W. Witarsa, D. Tay, A.A.O.
format	Conference or Workshop Item
author	Rao, V.S. Kripesh, V. Yoon, S.W. Witarsa, D. Tay, A.A.O.
spellingShingle	Rao, V.S. Kripesh, V. Yoon, S.W. Witarsa, D. Tay, A.A.O. Bed of nails: Fine pitch wafer-level packaging interconnects for high performance nano devices
author_sort	Rao, V.S.
title	Bed of nails: Fine pitch wafer-level packaging interconnects for high performance nano devices
title_short	Bed of nails: Fine pitch wafer-level packaging interconnects for high performance nano devices
title_full	Bed of nails: Fine pitch wafer-level packaging interconnects for high performance nano devices
title_fullStr	Bed of nails: Fine pitch wafer-level packaging interconnects for high performance nano devices
title_full_unstemmed	Bed of nails: Fine pitch wafer-level packaging interconnects for high performance nano devices
title_sort	bed of nails: fine pitch wafer-level packaging interconnects for high performance nano devices
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/85887
_version_	1821233755455488000

Bed of nails: Fine pitch wafer-level packaging interconnects for high performance nano devices

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