Understanding and testing for drop impact failure

Understanding and testing for drop impact failure

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

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書目詳細資料
Main Authors:	Seah, S.K.W., Wong, E.H., Ranjan, R., Lim, C.T., Mai, Y.-W.
其他作者:	MECHANICAL ENGINEERING
格式:	Conference or Workshop Item
出版:	2014
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/86105
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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