Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package
10.1109/TADVP.2004.830351
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Main Authors: | , , , , , , , , , , |
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Other Authors: | |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/89580 |
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Institution: | National University of Singapore |
Summary: | 10.1109/TADVP.2004.830351 |
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