Next generation of 100-μm-pitch wafer-level packaging and assembly for systems-on-package

• Main Authors: Tay, A.A.O., Iyer, M.K., Tummala, R.R., Kripesh, V., Wong, E.H., Swaminathan, M., Wong, C.P., Rotaru, M.D., Doraiswami, R., Ang, S.S., Kang, E.T.
• Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
• Format: Article
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/89580
• Institution: National University of Singapore

10.1109/TADVP.2004.830351