Improvement on lithography pattern profile by plasma treatment

Improvement on lithography pattern profile by plasma treatment

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

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Bibliographic Details
Main Authors: Soo, C.P., Bourdillon, A.J., Valiyaveettil, S., Huan, A., Wee, A., Fan, M.H., Ang, T.C., Chan, L.H.
Other Authors: MATERIALS SCIENCE
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/94011
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/94011

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