Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure

10.1023/A:1012590305144

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Main Authors: Latt, K.M., Sher-Yi, C., Osipowicz, T., Lee, K., Lee, Y.K.
Other Authors: PHYSICS
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/96031
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-960312015-02-17T15:12:23Z Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure Latt, K.M. Sher-Yi, C. Osipowicz, T. Lee, K. Lee, Y.K. PHYSICS 10.1023/A:1012590305144 Journal of Materials Science 36 23 5705-5712 JMTSA 2014-10-16T09:18:41Z 2014-10-16T09:18:41Z 2001-12-01 Article Latt, K.M.,Sher-Yi, C.,Osipowicz, T.,Lee, K.,Lee, Y.K. (2001-12-01). Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure. Journal of Materials Science 36 (23) : 5705-5712. ScholarBank@NUS Repository. <a href="https://doi.org/10.1023/A:1012590305144" target="_blank">https://doi.org/10.1023/A:1012590305144</a> 00222461 http://scholarbank.nus.edu.sg/handle/10635/96031 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description 10.1023/A:1012590305144
author2 PHYSICS
author_facet PHYSICS
Latt, K.M.
Sher-Yi, C.
Osipowicz, T.
Lee, K.
Lee, Y.K.
format Article
author Latt, K.M.
Sher-Yi, C.
Osipowicz, T.
Lee, K.
Lee, Y.K.
spellingShingle Latt, K.M.
Sher-Yi, C.
Osipowicz, T.
Lee, K.
Lee, Y.K.
Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure
author_sort Latt, K.M.
title Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure
title_short Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure
title_full Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure
title_fullStr Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure
title_full_unstemmed Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure
title_sort comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the cu/tan/sio2/si multilayer structure
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/96031
_version_ 1681091585830289408