Comparative study of copper films prepared by ionized metal plasma sputtering and chemical vapor deposition in the Cu/TaN/SiO2/Si multilayer structure

10.1023/A:1012590305144

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Bibliographic Details
Main Authors: Latt, K.M., Sher-Yi, C., Osipowicz, T., Lee, K., Lee, Y.K.
Other Authors: PHYSICS
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/96031
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Institution: National University of Singapore

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