Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure
10.1016/S0921-5107(00)00544-4
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2014
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sg-nus-scholar.10635-976262024-11-08T20:20:21Z Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure Latt, K.M. Lee, K. Osipowicz, T. Lee, Y.K. PHYSICS Diffusion barrier Electroplated (EP) Ionized metal plasma (IMP) 10.1016/S0921-5107(00)00544-4 Materials Science and Engineering B: Solid-State Materials for Advanced Technology 83 1-3 1-7 MSBTE 2014-10-16T09:37:27Z 2014-10-16T09:37:27Z 2001-06-21 Article Latt, K.M., Lee, K., Osipowicz, T., Lee, Y.K. (2001-06-21). Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure. Materials Science and Engineering B: Solid-State Materials for Advanced Technology 83 (1-3) : 1-7. ScholarBank@NUS Repository. https://doi.org/10.1016/S0921-5107(00)00544-4 09215107 http://scholarbank.nus.edu.sg/handle/10635/97626 000169321500001 Scopus |
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National University of Singapore |
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Asia |
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Singapore Singapore |
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Diffusion barrier Electroplated (EP) Ionized metal plasma (IMP) |
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Diffusion barrier Electroplated (EP) Ionized metal plasma (IMP) Latt, K.M. Lee, K. Osipowicz, T. Lee, Y.K. Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure |
| description |
10.1016/S0921-5107(00)00544-4 |
| author2 |
PHYSICS |
| author_facet |
PHYSICS Latt, K.M. Lee, K. Osipowicz, T. Lee, Y.K. |
| format |
Article |
| author |
Latt, K.M. Lee, K. Osipowicz, T. Lee, Y.K. |
| author_sort |
Latt, K.M. |
| title |
Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure |
| title_short |
Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure |
| title_full |
Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure |
| title_fullStr |
Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure |
| title_full_unstemmed |
Properties of electroplated copper thin film and its interfacial reactions in the EPCu/IMPCu/IMPTaN/SiO2/Si multilayer structure |
| title_sort |
properties of electroplated copper thin film and its interfacial reactions in the epcu/impcu/imptan/sio2/si multilayer structure |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/97626 |
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1821218762086416384 |